Emerson Presents Pressure, Motion and Control Solutions that Stabilize Processes Across High-Speed Packaging Lines at PACK EXPO 2026 (Booth N-5449)
October 9, 2026 Global technology, software and engineering leader Emerson presented its latest fit-for-purpose packaging solutions from AVENTICS™ and Afag brands at PACK EXPO 2026, from October 18-21 in Chicago. The Emerson booth (North Hall, Booth N-5449) featured the company’s latest precision compressed air motion control, electric motion and handling, and integrated control solutions. From…

