Parker Unveils Next Generation of High Performing Thermal Gap Filler Pads
The Chomerics division of Parker Hannifin Corporation, a leader in motion and control technologies, has announced the launch of THERM-A-GAP™ PAD 30 and THERM-A-GAP™ PAD 60, the next-generation of thermally conductive gap filler pads from Parker Chomerics. With performance of 3.2 W/m-K thermal conductivity, THERM-A-GAP PAD 30 reliably conforms to rough surface irregularities and air gaps on heat-generating components. For higher performance applications, THERM-A-GAP PAD 60 offers the enticing combination of both excellent thermal conductivity at 6.0 W/m-K, while being more than 40% softer than current like-performance thermal gap pads from Parker Chomerics.
